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Ultra-low metallic impurities (≤10 ppt for Al, Fe, Cu, Ni, Cr, Zn, Na, K, Ca, Mg)
Extremely low particulate count (<1 particle/mL at ≥0.1 µm, measured per SEMI F57)
Controlled anionic contamination (Cl⁻, NO₃⁻, PO₄³⁻ ≤ 50 ppt each)
High purity concentration (95.0–98.0 wt% H₂SO₄), precisely standardized and certified
Manufactured and packaged under ISO Class 4 (Class 10) cleanroom conditions with fluoropolymer (PFA/PTFE) wetted materials
Front-end wafer cleaning: removal of organic residues and native oxide in pre-gate and post-CMP processes
Photoresist stripping in advanced logic and memory fabrication (e.g., DRAM, NAND)
Etch accelerator and catalyst in sulfuric acid–hydrogen peroxide mixtures (SPM or Piranha solution)
Surface activation and hydrophilization prior to thin-film deposition (e.g., ALD, CVD)
Reagent in analytical calibration standards for semiconductor process control laboratories
| Chemical Type | Sulfuric Acid (H₂SO₄) |
| Product Form | Liquid, concentrated aqueous solution |
| Appearance | Clear, colorless, odorless liquid |
| Concentration (wt%) | 95.0 – 98.0% |
| Primary Applications | Wafer cleaning, photoresist stripping, surface preparation |
| Key Features | Ultra-low metals, low anions, low particles, high batch-to-batch consistency |
| Benefits | Minimizes defect generation, enhances process yield, extends tool uptime |
| Regulatory Compliance | SEMI C12 (Grade G5), RoHS 3 compliant; REACH registered; no SVHC on ECHA Candidate List |
| Common Compatible Systems | Suitability |
| Single-wafer spin-rinse developers (e.g., Tokyo Electron Ltd. CLEAN TRACK series) | Highly Recommended – Optimized for low-particulate delivery and precise dispense control |
| Batch immersion tools (e.g., SCREEN Dainippon Screen M8 series) | Recommended – Compatible with quartz and PFA-lined tanks; requires validated filtration |
| Inline wet benches with PTFE/PFA plumbing and 0.05 µm point-of-use filters | Highly Recommended – Ensures particulate integrity and chemical stability |
| Automated chemical dispensing systems (e.g., Entegris iDRY™, MKS Instruments AccuStream™) | Suitable – Requires dedicated sulfuric-acid-rated diaphragms and seals (FFKM or Kalrez®) |
Q1: What is the CAS Registry Number for this electronic grade sulfuric acid?
A: The CAS Number is 7664-93-9. This applies to high-purity H₂SO₄ regardless of concentration; our electronic grade product carries full traceability documentation per lot.
Q2: How does the recommended usage volume compare to technical-grade sulfuric acid in SPM formulations?
A: Volume ratios remain identical (e.g., 3:1 H₂SO₄:H₂O₂), but electronic grade eliminates the need for pre-filtration and reduces risk of metallic re-deposition—enabling longer bath life and lower cost-per-wafer in high-mix fabs.
Q3: Does this product meet USP/EP specifications for pharmaceutical use?
A: No. This product is formulated and certified exclusively for semiconductor manufacturing per SEMI standards—not for pharmaceutical, food, or medical device applications. It is not tested for residual solvents or endotoxins required by USP/EP.
Q4: Is there any risk of leaching or extractables from fluoropolymer containers during storage?
A: No significant leaching occurs under standard storage conditions (20–25°C, sealed PFA bottles). Extractables testing per SEMI F57 confirms <0.1 ppb F⁻ and undetectable fluorocarbon monomers after 30 days at ambient temperature.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
